SimuTech Group

Semiconductors

SoC Software by Ansys

In the new 3D-IC, stacked-die, and FinFET architectures, shrinking geometries mean design challenges in power and reliability, which impact design closure.

Achieve the accuracy and performance you need to determine the power noise integrity and reliability of complex ICs with Ansys SoC software for modeling and simulation (including thermal effects, electrostatic discharge phenomena, and electromigration.)