Rozendaalstraat 12 8900 Ieper Belgium
Use of an optimized architecture and a high density CMOS technology imparts our MLX90809 with best in class automotive electromagnetic compatibility (EMC) performance.
A digital signal processor or DSP-based architecture using a 16-bit microcontroller provides outstanding performance in terms of initial accuracy. A smart package and die assembly concept suits applications with stringent automotive temperature and stress conditions needing small drift over life.
Features and benefits
Robust package
Regards,
Automotive Technology Team
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Sincerely Packaging Labelling
Client Success Team (CRM),