Toshiba Launches Automotive 40V N-Channel Power MOSFET with New High-Heat Dissipation Package to Support Higher Current Demands of Automotive Equipment

3 February 2023

Toshiba Electronic Devices & Storage Corporation has launched a new L-TOGL  package The automotive 40V N-channel power MOSFETs XPQR3004PB and XPQ1R004PB . Both products feature high rated drain current and low on-resistance. Products start shipping today.

In recent years, with the conversion of vehicles to electric vehicles, the industry's demand for components that can meet the greater power consumption of in-vehicle equipment has also increased. These two new products adopt Toshiba's new L-TOGL package, which supports high current, has low on-resistance and high heat dissipation performance. The product does not use the internal terminal [1] structure, and integrates the source connector and the external pin by introducing a copper clip. The source pin adopts a multi-pin structure, and compared with the existing TO-220SM(W) package, the package resistance is reduced by about 30%, thereby increasing the drain rated current (DC) of XPQR3004PB to 400A, which is 1.6 times that of the current product [2] . The application of the thick copper frame reduces the channel-to-case thermal resistance in XPQR3004PB to 50% of the current product [2] . These features help to support higher current and reduce the loss of on-board equipment.

With the new packaging technology, the new product simplifies heat dissipation design and reduces the number of MOSFETs required for applications requiring high current, such as semiconductor relays and inverters for integrated starter generators, which in turn contributes to device size reduction. When it is necessary to connect multiple components in parallel to provide greater operating current for the application, Toshiba supports the shipment of these two new products in groups [3] , that is, the products are grouped according to the gate threshold voltage. This ensures that designs use products from the same group, thereby reducing characteristic deviations.

Because in-vehicle equipment may operate in a variety of temperature environments, surface mount solder joint reliability is a key factor to consider. The new product uses gull-wing pins to reduce adhesive stress and improve solder joint reliability.

Notes:
[1] Solder connection
[2] Current product: TKR74F04PB in TO-220SM(W) package
[3] Toshiba offers group shipments, and the gate threshold voltage floating range of each reel is 0.4V. But it is not allowed to specify a specific group. Please contact a Toshiba sales representative for more information.

application

  • Vehicle-mounted equipment: inverters, semiconductor relays, load switches, motor drivers, etc.

characteristic

  • New package L-TOGL TM
  • High Rated Drain Current:
  • XPQR3004PB: I D =400A
  • XPQ1R004PB: I D =200A
  • AEC-Q101 certified
  • Low On-Resistance:
  • XPQR3004PB: R DS(ON) =0.23mΩ (Typical) @V GS =10V
  • XPQ1R004PB: R DS(ON) =0.8mΩ (Typical) @V GS =10V
  • For more information on the new products, please visit:
  • XPQR3004PB
  • XPQ1R004PB

For more information on new product-related content, please visit the links below.

  • Introduction of new SMD package L-TOGL™ for automotive MOSFET (video)
  • Packaging Trends of Automotive MOSFETs
  • Application:

Automobile integrated starter generator
Automobile engine control
Vehicle-mounted DC-DC converter
Please click the link below to learn more about Toshiba Automotive MOSFETs.
Automotive MOSFET

To check the availability of new products at online resellers, please visit: XPQR3004PB
Buy Online

XPQ1R004PB
buy online

* L-TOGL™ is a trademark of Toshiba Electronic Devices & Storage Corporation.
* Other company, product and service names may be trademarks of their respective companies.

* The product prices and specifications, service content and contact information in this press release are the latest information on the date of publication. Thereafter subject to change without notice.

About Toshiba Electronic Devices & Storage Corporation

Toshiba Electronic Devices & Storage Corporation is a leader in advanced semiconductor and storage solutions, providing customers and business partners with outstanding discrete semiconductor, system LSI and HDD products based on more than half a century of experience and innovation.

The company's 23,000 employees around the world work together to maximize the value of the company's products, and at the same time attach importance to close cooperation with customers to promote the co-creation of value and new markets. Toshiba Electronic Devices & Storage Corporation looks forward to building on its current annual sales of over 850 billion yen (7.5 billion U.S. dollars) to create a better future for all mankind.
For more information, please visit: https://toshiba.semicon-storage.com/ap-en/top.html

Disclaimer: The original version of this announcement is the officially authorized version. The translation is for the convenience of understanding only, please refer to the original text, the original text version is the only legally valid version.

Contacts
Customer inquiries:

Power Components Sales and Marketing Department
Tel : +81-44-548-2216Contact
us

For media inquiries:
Chiaki Nagasawa
Digital Marketing Department
Toshiba Electronic Devices & Storage Corporation
Email: [email protected]

 

Source:businesswire.com